Thermal Conductive Epoxy Electrically Insulating Adhesive Compound, 2153, 2.5gm

Description

Technical Product Bulletin
THERMALLY CONDUCTIVE ELECTRICALLY INSULATING COMPOUND
PRODUCT DESCRIPTION:
AA-BOND 2153
is a thixotropic (smooth paste) thermal conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated
circuits
and other heat sensitive components to printed circuit boards.
AA-BOND 2153
is two parts adhesive develops strong, durable, high impact bonds at room temperature which improve heat transfer while maintaining electrical insulation.
AA-BOND 2153
bonds to itself and to metals, silica, alumina, others ceramics, glass, plastics and many other materials.
AA-BOND 2153
provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals.
GENERAL PROPERTIES:
Appearance
Dark grey
Cure
Type
Heat cure or room temperature
Benefits
Strong
Durable
High impact bonds at room temperature
Mix Ratio by weight
100:7 / Resin: Hardener
Outgassing, NASA
Passes
Typical Application
Staking transistors,
Diodes
Resistors
Integrated circuits
Other heat-sensitive components to printed circuit boards
UNCURED PROPERTIES:
Specific Gravity, mixed
2.44
Reactive solids contents, %
100
Pot Life
30 minutes
Shelf life
1 Year
THERMAL PROPERTIES:
CTE, linear
10.0 µin/in-°F
@Temperature 68.0 °F
Thermal Conductivity
6.94
BTU-in/hr-ft²-°F
Glass transition temperature (Tg), °C
110 °C,  230 °F
Operating Temperature
-70 to 125 °C
CURED PROPERTIES:
Hardness, Shore D
90
Dielectric strength, volts/mil
410
CURE SCHEDULE:
2 – 4 Hours
@ 65°C
24 Hours
@ 25°C
ELECTRICAL PROPERTIES:
Volume Resistivity
5.50e+15 ohm-cm |
4.00e+13
ohm-cm
@Temperature 212 °F
Dielectric Constant
6.0
@Frequency 1000 Hz
Dielectric Strength
410
kV/in
Dissipation Factor
0.010
@Frequency 1000 Hz
GENERAL   INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE:
1)
Carefully clean and dry all surfaces to be bonded.
2)
Apply AA-BOND 2153 completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
3)
Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use.
4)
Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best result.
AVAILABILITY:
This epoxy can be supplied in various different packages.
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